| • |
Ideal
inspection for solder paste thickness, dealing
with the increasingly growth of fine pitch,
enhanced printing technology and high precision
requirement |
| |
|
| • |
Prevent
various kinds of defect from printing process,
such as the bridging, deviation location,
etc... |
| |
|
| • |
Laser
vision measurement, without contact and
damage |
| |
|
| • |
Statistical
charts and process capability index be provided
as the real-time data for quality control |
| |
|
| • |
Easy
to operate, fast gather the printing data
for reference |
| |
|
| • |
Measure
printed solder thickness, height, length
and interval |
| |
|
| • |
Providing
various kind of statistical charts, such
as the distributive thickness chart, X-R
control chart and process capability index:
Cp, Cpm , Cpk for reference |
| |
|
| • |
Analyze
thickness for solder cross-section |
| |
|
| • |
Inspect
length and thickness for other kinds of
materials |
